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EP4SGX110DF29C4N 600MHz Electronics IC Chips

    Buy cheap EP4SGX110DF29C4N 600MHz Electronics IC Chips from wholesalers
     
    Buy cheap EP4SGX110DF29C4N 600MHz Electronics IC Chips from wholesalers
    • Buy cheap EP4SGX110DF29C4N 600MHz Electronics IC Chips from wholesalers

    EP4SGX110DF29C4N 600MHz Electronics IC Chips

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    Brand Name : Intel / Altera
    Model Number : EP4SGX110DF29C4N
    Price : USD 1~999 pcs
    Payment Terms : T/T, Western Union, Paypal, Trade Assurance, Credit Card
    Supply Ability : 498 pcs
    Certification : Lead free / RoHS Compliant
    Delivery Time : 3-5 Day
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    EP4SGX110DF29C4N 600MHz Electronics IC Chips

    EP4SGX110DF29C4N Industrial Electronic Components FBGA-780


    Product AttributeAttribute Value
    Intel
    FPGA - Field Programmable Gate Array
    Stratix IV GX
    372 I/O
    900 mV
    0 C
    + 70 C
    SMD/SMT
    FBGA-780
    Tray
    Data Rate:600 Mb/s to 8.5 Gb/s
    Series:Stratix IV GX
    Brand:Intel / Altera
    Maximum Operating Frequency:600 MHz
    Moisture Sensitive:Yes
    Number of Transceivers:8 Transceiver
    Product Type:FPGA - Field Programmable Gate Array
    Factory Pack Quantity:36
    Subcategory:Programmable Logic ICs
    Tradename:Stratix

    Feature Summary


    The following list summarizes the Stratix IV device family features:


    ■ Up to 48 full-duplex CDR-based transceivers in Stratix IV GX and GT devices supporting data rates up to

    8.5 Gbps and 11.3 Gbps, respectively


    ■ Programmable transmitter pre-emphasis and receiver equalization circuitry to compensate for frequency-dependent losses

    in the physical medium


    ■ Typical physical medium attachment (PMA) power consumption of 100 mW at 3.125 Gbps and 135 mW at 6.375 Gbps per

    channel


    ■ 72,600 to 813,050 equivalent LEs per device


    ■ 7,370 to 33,294 Kb of enhanced TriMatrix memory consisting of three RAM block sizes to implement true dual-port memory

    and FIFO buffers


    ■ High-speed digital signal processing (DSP) blocks configurable as 9 x 9-bit, 12 x 12-bit, 18 x 18-bit, and 36 x 36-bit full-precision

    multipliers at up to 600 MHz


    ■ Up to 16 global clocks (GCLK), 88 regional clocks (RCLK), and 132 periphery clocks (PCLK) per device


    ■ Support for high-speed external memory interfaces including DDR, DDR2, DDR3 SDRAM, RLDRAM II, QDR II, and QDR II+

    SRAM on up to 24 modular I/O banks


    ■ High-speed LVDS I/O support with serializer/deserializer (SERDES), dynamic phase alignment (DPA), and soft-CDR circuitry at

    data rates up to 1.6 Gbps


    ■ Support for source-synchronous bus standards, including SGMII, GbE, SPI-4 Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI,

    UTOPIA IV, NPSI, and CSIX-L1


    ■ Pinouts for Stratix IV E devices designed to allow migration of designs from Stratix III to Stratix IV E with minimal PCB impact.


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