Home > Xilinx FPGA Chip >

XC4VSX25-10FFG668C 320 I/O Virtex 4 FPGA

Product Categories

IC FPGA [50]
Xilinx FPGA Chip [20]
ALTERA FPGA Chip [20]
Broadcom Chip [11]
Field Programmable Gate Array [19]
Industrial Electronic Components [10]
Multilayer Ceramic Capacitor [10]
Murata Ceramic Capacitors [10]
Thin Film Resistor [10]
Isolated DC DC Converter [10]
Operational Amplifier Chip [19]
Digital Temperature Sensors [5]
RECOM DC DC Converter [10]
TRACO Power Distributors [6]

CHUANGXINDA ELECTRONICS-TECH CO., LIMITED

Contact Now

XC4VSX25-10FFG668C 320 I/O Virtex 4 FPGA

Ask Lasest Price
Brand Name :	Xilinx Inc.
Model Number :	XC4VSX25-10FFG668C
Certification :	Lead free / RoHS Compliant
Price :	USD 300~500 pcs
Payment Terms :	T/T, Western Union, Paypal, Trade Assurance, Credit Card
Supply Ability :	2545 pcs
Delivery Time :	3-5 Day

Add to Cart

Product Details
Company Profile

XC4VSX25-10FFG668C 320 I/O Virtex 4 FPGA

XC4VSX25-10FFG668C Xilinx FPGA Chip FBGA-668 320 I/O Virtex-4

Product Attribute	Attribute Value
Manufacturer:	Xilinx
Product Category:	FPGA - Field Programmable Gate Array
Product:	Virtex-4
Number of Logic Elements:	23040
Number of I/Os:	320 I/O
Operating Supply Voltage:	1.2 V
Minimum Operating Temperature:	0 C
Maximum Operating Temperature:	+ 85 C
Mounting Style:	SMD/SMT
Package / Case:	FBGA-668
Series:	XC4VSX25
Brand:	Xilinx
Distributed RAM:	160 kbit
Embedded Block RAM - EBR:	2304 kbit
Maximum Operating Frequency:	500 MHz
Moisture Sensitive:	Yes
Product Type:	FPGA - Field Programmable Gate Array
Factory Pack Quantity:	1
Subcategory:	Programmable Logic ICs
Tradename:	Virtex

Summary of Virtex-4 FPGA Features

• Up to twenty Digital Clock Manager (DCM) modules
- Precision clock deskew and phase shift
- Flexible frequency synthesis
- Dual operating modes to ease performance trade-off decisions
- Improved maximum input/output frequency
- Improved phase shifting resolution
- Reduced output jitter
- Low-power operation
- Enhanced phase detectors
- Wide phase shift range

• SelectIO™ Technology
- 1.5V to 3.3V I/O operation
- Built-in ChipSync™ source-synchronous technology
- Digitally controlled impedance (DCI) active termination
- Fine grained I/O banking (configuration in one bank)

• Extremely high-performance
- 600 Mb/s HSTL & SSTL (on all single-ended I/O)
- 1 Gb/s LVDS (on all differential I/O pairs)

• True differential termination
• Selected low-capacitance I/Os for improved signal integrity
• Same edge capture at input and output I/Os
• Memory interface support for DDR and DDR-2 SDRAM, QDR-II, and RLDRAM-II.

Product Tags:


*From:	Your email address is incorrect!
*To:	CHUANGXINDA ELECTRONICS-TECH CO., LIMITED
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!